SMT Capabilities:
- PCB Size (MAX) 510 mm × 460 mm
- PCB Thickness (MIN) 0.1 mm
- Chip Size (MIN) 0201 / 0402
- BGA Size (MAX) 50 mm × 50 mm
- Min. μ - BGA Pitch 0.3 mm
Equipment:
- High Speed RoHS SMT Lines - 8
- N2 SMT RoHS Reflow Lines - 4
- DIP Components Insert Lines - 3
- Final Assembly / Testing Lines - 4
- Special Process Lines - 2
(Silicon / Plastic mold potting, Conformal coating, etc.)
Testing:
- In Circuit Testing
- Functional Testing
- Electronic Data Yield Tracking
- Full Rev Control
- Documentation Review